? 1/9 table 1: main product characteristics i f(av) 30 a v rrm 600 v t j 175c v f (typ) 1.0 v t rr (max) 65 ns stth30l06 turbo 2 ultrafast high voltage rectifier k a to-220ac STTH30L06D k a do-247 stth30l06w k a a d 2 pa k stth30l06g k a sod-93 stth30l06p k a dop3i stth30l06pi october 2004 rev. 2 features and benefits ultrafast switching low reverse current low thermal resistance reduces switching & conduction losses description the stth30l06, which is using st turbo 2 600v technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode pfc boost diode. table 2: order codes part number marking STTH30L06D STTH30L06D stth30l06g stth30l06g stth30l06g-tr stth30l06g stth30l06w stth30l06w stth30l06p stth30l06p stth30l06pi stth30l06pi
stth30l06 2/9 table 3: absolute ratings (limiting values) table 4: thermal resistance table 5: static electrical characteristics pulse test: * tp = 5 ms, < 2% ** tp = 380 s, < 2% to evaluate the conduction losses use the following equation: p = 0.95 x i f(av) + 0.010 i f 2 (rms) table 6: dynamic characteristics symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) rms forward voltage 30 a i f(av) average forward current to-220ac / to-247 / d 2 pak / sot-93 tc = 125c = 0.5 50 a dop3i tc = 95c = 0.5 i fsm surge non repetitive forward current tp = 10ms sinusoidal 160 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature 175 c symbol parameter value (max). unit r th(j-c) junction to case to-220ac / to-247 / d 2 pak / sot-93 1.1 c/w dop3i 1.7 symbol parameter test conditions min. typ max. unit i r * reverse leakage current t j = 25c v r = v rrm 25 a t j = 150c 80 800 v f ** forward voltage drop t j = 25c i f = 30a 1.55 v t j = 150c 1.0 1.25 symbol parameter test conditions min. typ max. unit t rr reverse recovery time t j = 25c i f = 0.5a irr = 0.25a i r =1a 65 ns i f = 1a di f /dt = 50 a/s v r =30v 65 90 i rm reverse recovery current t j = 125c i f = 30a v r = 400v di f /dt = 100 a/s 11.5 16 a t fr forward recovery time t j = 25c i f = 30a di f /dt = 100 a/s v fr = 1.1 x v fmax 500 ns v fp forward recovery voltage t j = 25c i f = 30a di f /dt = 100 a/s v fr = 1.1 x v fmax 2.5 v
stth30l06 3/9 figure 1: conduction losses versus average forward current figure 2: forward voltage drop versus forward current figure 3: relative variation of thermal impedance junction to case versus pulse duration figure 4: peak reverse recovery current versus di f /dt (typical values) figure 5: reverse recovery time versus di f /dt (typical values) figure 6: reverse recovery charges versus di f /dt (typical values) p(w) 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 t =tp/t tp i (a) f(av) = 1 = 0.05 = 0.1 = 0.2 = 0.5 0 10 20 30 40 50 60 70 80 90 100 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 i (a) fm v (v) fm t =150c (typical values) j t =25c (maximum values) j t =150c (maximum values) j 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z/r th(j-c) th(j-c) t (s) p single pulse 0 5 10 15 20 25 30 35 40 45 0 50 100 150 200 250 300 350 400 450 500 i (a) rm di /dt(a/s) f i =2 x i ff(av) i=i ff(av) i =0.5 x i ff(av) v =400v t =125c r j 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 0 50 100 150 200 250 300 350 400 450 500 t (ns) rr di /dt(a/s) f i=i f f(av) i =0.5 x i f f(av) v =400v t =125c r j i =2 x i f f(av) 0 500 1000 1500 2000 2500 3000 3500 0 100 200 300 400 500 q (nc) rr i =2 x i ff(av) i=i ff(av) i =0.5 x i ff(av) v =400v t =125c r j di /dt(a/s) f
stth30l06 4/9 figure 7: reverse recovery softness factor versus di f /dt (typical values) figure 8: relative variations of dynamic parameters versus junction temperature figure 9: transient peak forward voltage versus di f /dt (typical values) figure 10: forward recovery time versus di f /dt (typical values) figure 11: junction capacitance versus reverse voltage applied (typical values) figure 12 : thermal resistance junction to ambient versus copper surface under tab (epoxy fr4, e cu =35m) (d 2 pak) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 50 100 150 200 250 300 350 400 450 500 s factor i< 2 xi t =125c ff(av) j v =400v r di /dt(a/s) f 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 i rm q rr t rr s factor t (c) j i=i reference: t =125c ff(av) j v =400v r 0 1 2 3 4 5 6 7 8 9 10 0 50 100 150 200 250 300 350 400 450 500 v (v) fp di /dt(a/s) f i=i t =125c f f(av) j 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 500 t (ns) fr di /dt(a/s) f i=i t =125c ff(av) j v =1.1 x v max. fr f 10 100 1000 1 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j r (c/w) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 s (cm2) cu
stth30l06 5/9 figure 13: d 2 pak package mechanical data figure 14: d 2 pak foot print dimensions (in millimeters) a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no lessthan 2mm ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 8.90 3.70 1.30 5.08 16.90 10.30
stth30l06 6/9 figure 15: do-247 package mechanical data figure 16: sod-93 package mechanical data f2 v2 l4 l2 l1 l3 d l l5 me h v v a dia. f3 g f ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 ref. dimensions millimeters inches min. max. min. max. a 4.70 4.90 0.185 0.193 c 1.17 1.37 0.046 0.054 d 2.50 typ. 0.098 typ. d1 1.27 typ. 0.050 typ. e 0.50 0.78 0.020 0.031 f 1.10 1.30 0.043 0.051 f3 1.75 typ. 0.069 typ g 10.80 11.10 0.425 0.437 h 14.70 15.20 0.578 0.598 l 12.20 0.480 l2 16.20 0.638 l3 18.0 typ 0.709 typ. l5 3.95 4.15 0.156 0.163 l6 31.00 typ. 1.220 typ. o 4.00 4.10 0.157 0.161
stth30l06 7/9 figure 17: sod-93 package mechanical data ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 1.45 1.55 0.057 0.061 c 14.35 15.60 0.565 0.614 d 0.5 0.7 0.020 0.028 e 2.7 2.9 0.106 0.114 f 15.8 16.5 0.622 0.650 g 20.4 21.1 0.815 0.831 h 15.1 15.5 0.594 0.610 k 3.4 3.65 0.134 0.144 l 4.08 4.17 0.161 0.164 n 10.8 11.3 0.425 0.444 p 1.20 1.40 0.047 0.055 r 4.60 typ. 0.181 typ.
stth30l06 8/9 figure 18: to-220ac package mechanical data a c d e m l7 h2 ? i l5 l6 l9 l4 g f1 f l2 table 7: ordering information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 m.n. (to-220fpac) / 0.55 m.n. (to-220ac) maximum torque value: 1.0 m.n. (to-220fpac) / 0.70 m.n. (to-220ac) ordering type marking package weight base qty delivery mode STTH30L06D STTH30L06D to-220ac 1.90 g 50 tube stth30l06g stth30l06g d 2 pak 1.48 g 50 tube stth30l06g-tr stth30l06g d 2 pak 1.48 g 1000 tape & reel stth30l06w stth30l06w do-247 4.40 g 30 tube stth30l06p stth30l06p sod-93 3.79 g 30 tube stth30l06p stth30l06p dop3i 4.46 g 30 tube ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 table 8: revision history date revision description of changes 07-sep-2004 1 first issue. 21-oct-2004 2 dop3i package added.
stth30l06 9/9 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2004 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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